Thin Film Circuit Technology hmanga siam a ni

Thin Film Circuit Technology hian thin film deposition, photolithography, etching, leh metallization process hmangin ceramic, glass, emaw silicon-based materials chung lamah micron-scale conductive line a siam a, hei hian high-density, high-reliability electronic integration a siam thei a ni.

Linear Precision sang tak nei:Precision photolithography leh vacuum deposition process hmangin standard linewidth leh spacing chu 20μm a thleng thei a, special project-ah chuan 10μm level a thleng thei a ni.

Signal hloh tlem:High-purity metal thin film leh fine line design hian resistance leh transmission loss a ti tlem a, 5G communication, millimeter-wave, leh high-speed electronic system atan a tha hle.

Heat Dissipation tha tak a ni:Thermal conductivity sang tak substrate alumina leh aluminum nitride te nena inzawm chuan heat hi rang takin a bo thei a, device temperature a tihhniam bakah system stability a ti tha hle.

Substrate hmanrua: 1.1.Alumina (Al2O3), Aluminum Nitride (AlN), Silicon Nitride (Si3N4), Glass-Ceramic hmanga siam a ni.

Metal System hrang hrang: 1.1.Rangkachak, Tangkarua, Copper, Nickel, Platinum, leh Custom Multilayer Metal Structure te a awm a.

Thin Film Deposition-ah hian a awm a:Metal leh functional film hrang hrang siamna kawngah a pui thin.

Lithography dik tak: 1.1.Micron-level circuit patterning a siam thei.

Etching dik tak chu:Circuit dimension leh consistency a enkawl.

Lei chunglam Metallization: 1.1.Gold plating, silver plating, leh ENIG processing te a support bawk.

Multilayer Integration hmanga inzawmna:Single-layer, double-layer, leh multilayer structure design te a support.

Semiconductor hmanga thil siam chhuah:High-density interconnect leh advanced packaging substrate atan hman thin.

Power Electronics hmanga thil siam:IGBT, SiC, leh power module-ah te hman a ni.

RF Inbiakpawhna: 1.1.5G, millimeter-wave, leh radar system atan a tha.

Automotive Electronics hmanga thil siam chhuah:Energy thar lirthei leh automotive-grade module-a hman thin.

Damdawi lam Electronics: 1.1.High-reliability electronic devices mamawh a tlin.

Aerospace atanga lo chhuak:Temperature sang-temperature leh complex environment application atan a tha.

Drawing Customization hmanga siam dan:Gerber leh CAD file siamna a support bawk.

Material Customization hmanga siam dan:Thermal conductivity leh electrical performance mamawh dan atanga material thlan dan.

Structure tihchangtlun dan:Circuit leh multi-layer structure design a support bawk.

Mass Production atanga sample lak tur:One-stop development services a pe thin.

20+ Kum tam tak chhung thil siam chhuah lama tawnhriat nei
Kum 2003-a din niin, R&D leh inorganic thil thar siamna lama tui tak, kum 20 chuang zet industry lama tawnhriat nei tawh a ni.

Production theihna nghet tak neih theihna
Production base lian tak-a nei a, manufacturing system kimchang tak a nei a, global client atanga hun rei tak-stable procurement a thlawp a ni.

Professional R&D Team te an ni
Material R&D leh performance optimization theihna a nei a, customized solutions a pe thei bawk.

Quality Control khauh tak neih a ni
Testing hmanrua hmasawn tak tak hmanga thuam, product quality leh batch stability khauh taka control.

Khawvel pum huapa Export lama tawnhriat nei
Products hi ram pawn market-ah thawnchhuah a ni a, export service puitling tak tak leh customer support theihna neiin a awm bawk.

Customized Solutions te chu a hnuaia mi ang hian a ni
Customer mamawh hrang hrang phuhruk nan product specification, performance, leh application mamawh customization a support.