Alumina chu a zungpui (spherical Alumina) a ni

Spherical Alumina hi spherical thermal conductive filler a ni a, alumina single crystals te chu high-temperature melting leh calcination hmanga siam a ni a, chu chu precision classification leh purification process hmanga siam niin, controlled particle size distribution, sphericity sang tak, leh stable thermal performance neih theihna tur a ni.

Particle size distribution hi thermal conductivity target, filler loading mamawh, leh processing condition a zirin thlan theih a ni.

Fine Particle Grade hrang hrang te
Dispersion tha zawk, smooth processing, leh stable filler distribution mamawhna atana hman tur, thermal grease leh conductive adhesives te tan a tha.
Medium Particle Size Grade hrang hrang te
Silicone pad leh epoxy thermal compound te tan filling theihna, thermal conductivity, leh processability balance siamsak.
Particle Size Grade lian tak tak te
Packing efficiency tihchangtlun leh thermal conductivity tihsan ngai high-loading formulations atana duan a ni.

Particle size distribution hrang hrangte chu inzawmkhawmin particle packing density, filler loading efficiency, leh processing performance te tihchangtlun theih a ni.

Sphericity sang tak nei Particle Structure a awm
98% thlenga spherical morphology hian powder packing efficiency a ti tha a, polymer matrices-a uniform dispersion a thlawp bawk.
Particle Size Insem dan Controlled a ni
Multiple particle size grades hmang hian thil siamtute chuan thermal conductivity, loading, leh processing mamawh hrang hrang atan filler characteristic tha tak tak an thlang thei a ni.
Alumina thianghlimna sang tak nei
All2O3 thianghlimna 99.9% aia tam emaw, a tlukpui emaw hian electronic leh thermal management application atan chemical performance nghet tak leh thermal property rintlak tak a pe a ni.
Flowability leh Processing Performance tha zawk siam a ni
Smooth spherical structure hian powder flow behavior a ti tha a, mixing laiin particle friction a ti tlem a, thermal conductive composites stable processing a support bawk.
Moisture hniam ziarang a nei
Moisture content hniam hian moisture-sensitive electronic leh polymer application-ah performance mumal tak vawng reng turin a pui a ni.

Thermal Interface hmanrua te
Thermal conductive silicone pads, silicone grease, potting compound, leh phase change materials-ah te hman a ni a, heat transfer tha tak leh thermal performance nghet tak mamawh a ni.
Power Electronic hmanga lumna tihbo theihna tur thil siam
Power module, converter, leh electronic hmanrua atana heat dissipation performance rintlak mamawhna thermal management system-a hman a ni.
Thermal Conductive Engineering Plastic hmanga siam chhuah a ni
LED housing, electronic enclosure, leh electrical component-a hman a ni a, heat dissipation tihchangtlun leh design rit lo tak a ngai a ni.
Aluminium-Based Copper Clad Laminate hmanga siam a ni
High-power LED circuit board leh power electronic substrate-ah hman a ni a, thermal conductivity tihpun leh heat spreading capability tihpun a ngai a ni.
Thermal Conductive Adhesives hmanga siam a ni
LED module leh electronic assembly-a hman a ni a, thermal transfer rintlak leh bonding performance mamawh a ni.

ZC-TECH hian professional material analysis leh testing method hmangin chemical composition, particle characteristics, leh powder performance te a enfiah thin.

Chemical Composition thlirletna a ni
All2O3 thianghlimna leh bawlhhlawh level te chu control a ni a, chu chuan material performance nghet tak a vawng reng thei a ni.
Particle Size Insem dan thlirletna
D10, D50, leh D90 particle size parameter te chu filling behavior leh processing performance mumal tak neih theih nan enfiah a ni.
Particle Morphology enfiahna a ni
Particle morphology analysis hian spherical structure a finfiah a, stable dispersion leh thermal transfer performance a thlawp bawk.
Powder Property Testing neih a ni
Surface area bik, ionic conductivity, moisture content, leh powder characteristic dangte test hian application consistency a thlawp a ni.